Microelectronics, Technologies and Components (CERTeM)

 
  • PVD (Physical Vapour Deposition) - PLASSYS
  • PLD (Pulsed Laser Deposition) - MECA 2000
  • E-beam evaporation - PLASSYS
  • Supercritical Dryer - SEPAREX
  • Cleaning wet bench - LAY CONCEPT 
  • Etching wet bench - LAY CONCEPT
  • H3PO4  etching wet bench - LAY CONCEPT
  • Solvent wet bench - LAY CONCEPT
  • Silicon anodization wet bench - LAY CONCEPT
  • Rapid Thermal Annealing TGZM (Thermal Gradient Zone Melting) - AET
  • UV Rapid Thermal Annealing - JIPELEC
  • High Temperature Annealing - CENTROTHERM
  • PECVD (Plasma Enhanced Chemical Vapour Deposition) - OXFORD
  • PECVD (Plasma Enhanced Chemical Vapour Deposition) - LPTS
  • LPCVD (Low Pressure Chemical Vapour Deposition) - TETREON
  • LPCVD (Low Pressure Chemical Vapour Deposition) - TETREON
  • RIE-ICP (Reactive Ion Etching – Inductive Coupled Plasma) - CORIAL     
  • IBE (Ion Beam Etching) - PLASSYS
  • Four-circle high resolution diffractometer - BRUKER
  • Spin Coater - Süss Microtec RC8
  • Spin Coater - EVG101
  • Automatic developers ATMvision Optiwet ST30
  • UV Insulator (350-450nm) - Süss Microtec MA1006
  • UV Insulator (lampe Hg 500/1000W) - EVG6200