Microelectronics, Technologies and Components

Equipments

  • PVD (Physical Vapour Deposition) - PLASSYS

  • PLD (Pulsed Laser Deposition) - MECA 2000        
            
  • E-beam evaporation - PLASSYS

  • Supercritical Dryer - SEPAREX

  • Cleaning wet bench - LAY CONCEPT 
            
  • Etching wet bench - LAY CONCEPT

  • H3PO4  etching wet bench - LAY CONCEPT

  • Solvent wet bench - LAY CONCEPT

  • Silicon anodization wet bench - LAY CONCEPT

  • Rapid Thermal Annealing TGZM (Thermal Gradient Zone Melting) - AET

  • UV Rapid Thermal Annealing - JIPELEC

  • High Temperature Annealing - CENTROTHERM

  • PECVD (Plasma Enhanced Chemical Vapour Deposition) - OXFORD

  • PECVD (Plasma Enhanced Chemical Vapour Deposition) - LPTS

  • LPCVD (Low Pressure Chemical Vapour Deposition) - TETREON

  • LPCVD (Low Pressure Chemical Vapour Deposition) - TETREON

  • RIE-ICP (Reactive Ion Etching – Inductive Coupled Plasma) - CORIAL     

  • IBE (Ion Beam Etching) - PLASSYS

  • Four-circle high resolution diffractometer - BRUKER

  • Spin Coater - Süss Microtec RC8

  • Spin Coater - EVG101

  • Automatic developers ATMvision Optiwet ST30

  • UV Insulator (350-450nm) - Süss Microtec MA1006

  • UV Insulator (lampe Hg 500/1000W) - EVG6200